Global Advanced Metals

  • Home
  • About Us
    • Management Team
    • Global Operations
    • EICC Membership
  • About Tantalum
    • Sources
    • Applications
    • Supply Chain
    • Responsible Supply
  • Our Operations
    • GAM Technology
      • Aizu - Japan
      • Boyertown - USA
      • Research and Development
    • GAM Resources
      • Wodgina - Australia
      • Greenbushes - Australia
      • Exploration
    • Trading
  • Our Products
    • Capacitor Powders
      • Product Range
    • Tantalum Concentrate
      • Typical Product Specifications
    • Tantalum Metallurgical Products
      • Typical Product Dimensions
    • Niobium Metallurgical Products
      • Typical Product Dimensions
    • Tin
  • Sustainability
    • Our Policy
    • Our Awards
    • Our Communities
    • Conflict Free Policy
  • Jobs
  • News
    • Announcements
      • 2012
      • 2011
    • Articles
      • 2011
  • Contact Us
  • Our Products

    • Capacitor Powders
      • Product Range
    • Tantalum Concentrate
    • Tantalum Metallurgical Products
    • Niobium Metallurgical Products
    • Tin
  • Home
  • Our Products
  • Capacitor Powders
  • Product Range

Product Range

 

Powder Angular or EB
Nodular Flake
Manufacturing Process
Electron Beam Melted
Chamically Reduced
Chemically Reduced, Physically Formed
Primary Particle Size (microns)
1 - 10
0.2 - 2
Aspect Ration 20 to 50
Aggregate Size (microns)
50 - 300
20 - 250
25 - 200
Surface Area (m2/g)
<0.3 0.3 - 0.9
-
Typical Applications High Voltage, High Reliability Low Voltage, High Capacitance Medium Voltage, Medium Capacitance

 



  • © Copyright Global Advanced Metals Pty Ltd 2010
  • Privacy & Disclaimer
  • Sitemap
  • Website Search

Website Design by Clarity Communications